Silencing power supply unit FSP FX600-GLN

    Place back all component parts which were unsoldered before (with radiators), turn over the card, put it on legs, and fasten radiators to the shared one. The card height over shared radiator is precisely regulated: 56 mm. Solder all active elements which lay on the radiator to the card. Use 40/60 tin/lead alloy solder (30 is also acceptable), refractory (refrectoriness = 235C). I soldered with a soldering set-up ST-963; its soldering iron is low-power, so I had to increase temperature to 280C. Take a drop of solder and a bit of colophony, put it on the outlets; the solder hardens, keep until fusion. Since the component parts are placed on radiators, there is a little risk of overheating; however you have to solder longer and with higher temperature. Fasten the heat removers. Spread the heat-conducting adhesive on rings and transformers (thick layer), smear appropriate heat removers with the adhesive too. Put the card on legs, check its height (56 mm), and make sure that hot adhesive flew together on every ring and heat remover. Leave it to harden (for 24 hours). I spent five and a half syringes of adhesive on it.
 
 

    Unfasten the heat removers and radiators carefully. Look what you’ve got.